SK Hynix will invest 19 trillion won in a new advanced chip packaging facility in Cheongju to boost capacity for AI-driven ...

SK Hynix announces a $12.9 billion investment in a new chip packaging facility in Cheongju to address global AI memory chip ...

SK Hynix Inc, a key supplier to Nvidia and one of the worlds largest memory chipmakers, announced plans to invest 19 trillion ...

SK Hynix is set to invest nearly $13 billion in a state-of-the-art chip packaging facility in South Korea, responding to ...

Apple's A20 chip in the iPhone 18 will be packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology, according to Apple supply chain analyst Ming-Chi Kuo. This change has been rumored by ...

Ever wonder where those powerful NVIDIA graphics cards actually come from? It’s not as simple as you might think. The journey ...

Apple is in talks with suppliers to manage iPhone chip assembly and packaging in India for the first time, reports The Economic Times. "Exploratory conversations" are said to have taken place with ...

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

This TechXchange examines chip packaging technology including new advances such as chiplets. Check out the video series on chip packaging. Packaging: A 30-Year Career Retrospective We’ve come a very ...