TIBURON, Calif.--(BUSINESS WIRE)--Jon Peddie Research (JPR) today announced the availability of its free eBook titled Accelerating and Advancing CAE. Since the start of the year, Jon Peddie Research ...

PARIS — Software companies PTC and Ansys have teamed up to build two products that leverage simulation to speed up the digital design process for engineers. The first product, Creo Simulation Live, ...

Hexagon’s Manufacturing Intelligence division has announced the release of ODYSSEE A-Eye, a new artificial intelligence (AI) tool that enhances Computer-Aided Engineering (CAE) for a multitude of ...

Running a single physics simulation can take hours or days, depending on the complexity of the geometry and the equations involved. For engineers iterating through hundreds of design variations, that ...

As a leading member of the institute, Duke will accelerate the collaboration’s next phase of quantum simulation research, ...

$20M in Series A funding from BMW i Ventures, Uncorrelated Ventures and Earlybird Venture Capital will be used to bring simulation best practices from the world's top companies to design engineers ...

Nuclear energy is responsible for approximately one-fifth of total electricity used in the U.S., and nearly half of the country's renewable electricity. Most of the reactors generating this ...

In the mid-90s, videogames on the computer were starting to boom. 3D graphics were the cutting-edge, and the normal Gateway desktops couldn’t handle the visual demands without a dedicated “video card.

In engineering applications, cloud computing can provide the on-demand compute power needed to run increasingly more complex simulations on a more frequent basis throughout the design cycle.

Physics simulations have a problem—engineers who need those simulations’ results often don’t have time to wait. Add in real-world settings with multiple independent calculations required (for example, ...

Producing modern semiconductor devices is an immensely challenging process. Successful execution entails advanced process nodes, novel device architectures, new materials, and many fabrication steps.