11h
Chinese research team achieves breakthrough in chip heat dissipation, boosting device performance
VCG. Chinese researchers have achieved a major breakthrough in semiconductor materials integration by developing an ...
Master Bond EP54TC—is engineered for critical thermal management applications, featuring the highest thermal conductivity.
In recent years, the space industry has experienced unprecedented explosive growth, with the number of satellite launches increasing exponentially. By the end of 2023, the number of global operational ...
Samsung is set to introduce a new heat dissipation technology with the Exynos 2600. Samsung appears so confident of its effects that it also wants to sell it to clients such as Qualcomm. If that works ...
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where ...
A Reddit user attached M.2 SSD heatsinks to their iPhone 17 Pro Max for extreme cooling. The mod, although bulky and aesthetically unappealing, significantly improves the phone’s sustained performance ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback