For wafers with 125 millimeter long sides, the average rate is a few percent, which explains why raw wafer singulation is still very often done by hand. But as wafers get thinner and larger, even ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

Conventional laser cutting is based on rapid heating leading to vaporization and material removal. This process is not only slow, but it also leads to unwanted micro cracks and a rough surface finish.

New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate CAGR of ...

Complete Probe Solutions developed Single Die Alignment for automatically probing die that are not precisely positioned or misaligned relative to each other. The Single Die Alignment feature makes it ...

ST. PETERSBURG, USA: Plasma-Therm has entered into a new cross licensing agreement with ON Semiconductor to enable wafer singulation processes. The agreement includes cross licensing of technology ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

Solar power still costs more than energy gained from burning coal or gas. That fact may put opponents of subsidies up in arms, but it’s great for companies that automate photovoltaic (PV) ...

A novel approach to cutting brittle materials such as glass, sapphire and other key components of portable device screens has been developed by a trio of technology companies in Germany and the US.

New technology for cheaper and higher quality cutting of brittle materials for displays, phones and LED lighting. PORTLAND, Ore. and KRAILING, Germany, Aug. 31, 2012 /PRNewswire-iReach/ -- Three ...